应用范围/Application Data：
SMT底部填充、元件封装、点锡膏、点红胶、点黑胶、半导体封装、晶元固定等
SMTunderfill,; Component packaging; Paste, red glue, black glue dotting;Semiconductor packaging; Chip fixing.
特点/ Feature：
Ø 采用电脑控制，WINDOWSXP操作系统，故障声光报警及菜单显示
PC control card, WINDOWS XP operate system,failure warning with menu.
Ø CCD视觉定位系统
CCD visual position
Ø 采用伺服马达+滚珠丝杆驱动
Servo motor + screw drive
Ø 可任意搭载：喷射阀、螺杆阀、撞针阀、气压阀
Can be equipped with:Jetting nozzle, screw nozzle, Pin type nozzle, and pressure nozzle.
Ø 阀体自动恒温系统，确保涂料的流动性一致
Automatic nozzle constanttemperature to make sure the consistencyof material liquidity.
Ø 可直接导入任何品牌的贴片机文件，也可在线视觉编程
Can lead in any Pick and Place system file, and also can be programmedin line.
Ø 可选配喷射阀或螺杆阀
Can choose with jetting nozzle or screw nozzle as option.
Ø 可选配激光高度检测系统，工件变形后可自动校准Z轴高度
Can choose laser height detection system as option, and it can calibratethe component height automatically after the component’s shape changed.
Ø 可选配工件加热系统，增强底部填充时涂料的流动性
Can choose board heating system as option to strength the materialliquidity when underfil
Ø 可选配精密测重系统，智能控制及检测点胶量，确保点胶的一致性
Can choose accurate weighing system as option, intelligent control anddetect glue out amount, make sure the consistency when glue out
Ø 可选配双轨道系统，不用等待进出板时间，大大提高效率
Can choose double conveyor system as option;Do not need to wait the board in-out time.
Ø 可选配倾斜旋转系统，胶阀可自动倾斜35°，可360°任意旋转（此功能只能搭载1套阀）
Ø 可选配大容量供料系统，减少添加或更换涂料的频率，涂料容量自动检测。
Can choose big capacity materialsystem as option, reduce the frequency of adding material, automatic detect thematerial amount.
功能配置/Functions | 技术参数及说明/ Specification |
整体式机架/Integral frame | 1200L 1270W 1600H (mm) |
全电脑控制/Whole PC control | 专用工业电脑/Special industrial PC |
CCD视觉定位/CCD vision position | 自动校准运行精度/Automatic calibrate working accuracy |
输送轨道 Conveyor | 配高温皮带输送,3段停板模式 /with high temperature belt conveyor, 3 section PCB stopping mode |
步进马达输送/ Stepper motor transfer | 20m/min |
自动调幅/Automatic adjust width | 单轨道/Single conveyor：50～450mm 双轨道/Double conveyor：50～200mm 2套/set |
X、Y、Z驱动方式/X,Y,Z drive mode | 伺服马达/Servo motor |
最高速度/Max. travel speed | 1000mm/S |
运行精度/Operation accuracy | 0.01mm |
点胶行程Dispensing area | X=450mm, Y=450mm,Z=50mm（带加热系统X=350mm,带RZ=40mm） X=450mm,Y=450mm,Z=50mm /(with heating system，X=350mm,with RZ=40mm） |
胶阀数量/Nozzle Qty. | 1套（任选1套）/1 set（optional 1 set） |
阀体加热/Nozzle heating | |
涂料容量/Material capacity | 30CC |
涂料检测/Material detection | 自动检测/Automatic detection |
阀嘴清洗装置/Nozzle cleaning device | 真空清理/Vacuum cleaning |
输入气压报警/Input pressure alarm | 菜单+声光报警/menu+warning alarm |
扫描仪插口/Scanner port | 232插口/232 port |
通讯接口/Communication port | SMEMA |
编程模式/Program mode | 可导入任何贴片机文件或在线视觉编程 / Can lead in any Pick and Place system file, and also can be programmed in line. |
输入电压/Input power | 220V 50～60HZ |
气压/Pressure | 4kg/cm2 |
总功率/Total power | 3kw |
总重量/Total weight | 680kg |
安全标准/Compliance | CE |
选配项目/Option | |
工件加热系统/Board heating system | 等待区上下加热，工作区下加热，室温～150℃±3℃ Waiting area up/down heating, working area up/down heating, temp.～150℃±3℃ |
双轨道系统/Double conveyor system | 无需等待进出时间，提高效率/No need to wait board in/out time |
激光测高/Laser height detection | 激光自动高度检测，工件变形后可自动校准Z轴高度/Laser automatic height detection, automatic calibrate Z axis height after component’s shape changed. |
旋转系统+倾斜螺杆阀/ Rotation system+tilt screw | Screw nozzle tilt 0-30°,360° rotation, strength the bond area between material and component. |
螺杆阀/Screw nozzle | 供胶稳定精准，维护方便/Steady and accurate glue supply |
撞针阀/Pin type nozzle | 液态涂料表面涂覆用/ Liquid material conformal coating |
喷射阀/Jetting nozzle | 最高点胶速度/Max. working speed：200/S/ |
精密测重系统/Precise height detect system | 误差/Difference: 0.1mg |
大容量供料系统/Big capacity material supply | 300CC，自动检测/Automatic detection |
